CPU Microprocessor Cold Plate Cooling Heat Sink Electronic Devices
Solution
Cold Plate Heat Sink for CPU Microprocessor Electronic Devices
Advanced liquid cooling solutions for high-performance computing
applications including AI, data centers, and electronic devices
requiring superior thermal management.
Manufacturing Specifications
| Business Type | Factory / Manufacturer |
|---|
| Products | Skiving Fin Heatsinks, Liquid Cold Plates, Extruded Heatsinks,
Stamping Heatsinks, Heat Pipe Heatsinks, Vapor Chamber, CNC
Machined Parts |
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| Type | Heatsinks |
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| Service | OEM service, professional R&D support |
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| Material | Aluminum/copper |
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| Tool Cost | No Needed |
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| Process | Cutting, Skiving, Extruded, Stamping, Rolling, Broaching, Punching,
Drilling, Bending, Welding, Milling, Turning, CNC Machining,
Grinding, Deburring, Cleaning, 100% Inspection, Packing, Delivery |
|---|
| Surface Treatment | Polishing, anodizing, powder coating, passivating, painting,
plating, sand blasting, e-coating and others as requested |
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| Dimension | Customized (Maximum skived heat sink size: W 1200 × L 3500mm) |
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| Inspection | CMM, Two dimensional measuring instrument, Projector, Flatness
measurer, Roughness measurer, Helium leaking testing equipment |
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| Delivery Time | Sample lead time: 15-21 days. Production lead time: 25 days. |
|---|
Industry Applications
Photovoltaics, Wind Power, Communications, LED, Electric Vehicles,
Medical, Rail Transit, Microwaves, Automobile, Lasers, High Power
Solar Inverter, High Power LED light, Data Center, IGBT cooling,
Welding Machine, Artificial Intelligence
Advanced Cooling Solutions for Next-Generation Processors
With the rise of AI and HPC processing massive data volumes,
next-generation processors will generate significantly more heat
than current high-end models. Our liquid cooling solutions maximize
heat dissipation efficiency, improve PUE values, and increase
computing density per rack, positioning liquid cooling as essential
for future data center infrastructure.
High-End Manufacturing Applications
Semiconductor and Chip Manufacturing
Advanced packaging technologies like 3D stacking create internal
heat accumulation where traditional material thermal conductivity
becomes a bottleneck.
AI Computing/Data Centers
Surging chip heat flux density challenges traditional cooling
methods, making thermal management a critical factor in computing
power improvement.
Aerospace
Extreme temperature environments and vacuum conditions eliminate
convective heat dissipation options, requiring specialized thermal
management solutions.
Everyday Applications
Digital Devices
Metal cooling fins in computers, mobile phones, and game consoles
ensure sustained performance.
Communication Devices
Large heat sinks maintain stability for high-speed data
transmission and processing.
Household Appliances
Compressors and condensers require efficient heat transfer from
indoor to outdoor environments.
Lighting Devices
Efficient heat dissipation ensures LED luminous efficacy and
extended service life.
New Energy Vehicles
Sophisticated liquid cooling systems maintain optimal operating
temperatures.
Manufacturing Capabilities
Our mold workshop features 22 electric discharge machines including
2 MAKINO mirror EDM machines, 9 wire-cut EDM machines (3 Seibu and
1 Sodick from Japan), 7 spark erosion machines, 10 grinding
machines, 2 milling machines, and 1 lathe.
Technical Specifications
- Table size: 500×350 mm
- Rapid traverse speed: 5000 mm/min
- Maximum workpiece weight: 500 kg
- Maximum electrode weight: 50 kg
Precision Engineering
Utilizing SuperSpark4 and IES (Intelligent Expert System)
technologies for adaptive power supply and jump control to
stabilize EDM processes and enhance machining precision. Advanced
ultra-surface and ultra-edge generator technologies deliver
exceptional surface finish and metallurgical quality.
Product Applications
Quality Assurance
Rigorous quality standards maintained with comprehensive testing
equipment:
- 1 Coordinate Measuring Machine
- 1 projector instrument
- 2 water high pressure testing machines
- 4 thermal resistance testing machines
- 2 liquid leakage testing machines
Customer Service Commitment
- Prompt response to all inquiries
- Competitive pricing with guaranteed quality
- Efficient production scheduling
- Optimal transportation solutions
- Comprehensive technical support
Frequently Asked Questions
Are you a trading company or manufacturer?
We are a professional manufacturer of heat sinks and water cooling
plates with extensive experience and a strong technical team,
featuring automated and mechanized production.
Have you exported goods before and to which regions?
60% of our total production is exported to Japan, India, UK,
Canada, USA, and Brazil.
How many employees do you have?
Approximately 100 employees across sales, purchasing, engineering,
QA, warehouse, and production departments.
Can you provide samples if we agree with the design?
Yes, we provide samples for confirmation before mass production,
along with technical drawings if required.
What packing methods do you use?
Customized packing with normal cartons and tight-proof fabric or
wooden cartons for optimal protection during transportation.
Do you provide technical support for product issues?
All products are fully inspected before shipping. For any issues,
we provide immediate technical solutions.
